RECOM PUMA modules are based on the Shingled Monocrystalline technology which allows higher cells density than standard half-cut modules. Shingled technology eliminates traditional ribbon connection with shingles connected in series. By removing the soldered ribbons, the active area of the module is improved, and thermal stresses are reduced – resulting in exceptional efficiency and reliability over standard interconnections. With higher yield per surface area, PUMA modules deliver outstanding performance under extreme heat as well as low intensity solar radiation.
REDUCED RISK OF MICRO CRACKS
The replacement of soldered ribbons with a low temperature and flexible ECA decreases
thermal stresses during the modules production and operation, decreasing the risk of
micro cracks formation. Mechanical stresses (e.g. snow load) are relieved by the flexible interconnection, improving the reliability in harsh environments (as reflected in the increased warranty provided).
HIGHER CELLS DENSITY AND IMPROVED AESTHETICS
The inactive area is considerably reduced, no ribbons and cells gaps on strings improving the efficiency and aesthetic in full black modules.
LOWER RESISTIVE LOSSES AND THERMAL COEFFICIENT
The resistive losses in strings are considerably decreased thanks to the lower current of
shingles (1/6 or 1/7 of the original cell) and the lack of interconnection.